Dynatex International has been the leader in dry process dicing and wafer dicing materials in a wide array of industries. We are committed to provide solutions for die/diode dicing and wafer processing applications and solutions designed to increase yields, maximize throughput, and minimize operator intervention.

Wafer Bonding Systems


Wafer bonding in semiconductor manufacturing is the method of attaching a wafer to a substrate or a wafer to wafer. If a wafer must be mounted to a substrate for additional processing, the substrate in question is referred to as the handle wafer. In other applications, however, wafer to wafer bonding is typically employed to take advantage of the material properties of the two wafer types.

Traditionally, wax adhesives have been employed due to their low cost and diminished residue. However, with the requirement for low tolerance total thickness variation (TTV), Minhee Kim and Somenath Mitra at the New Jersey Institute of Technology described the use of Dynatex International’s WaferGrip as a superior alternative. In bonding ultra thin silicon substrates, Sotiris Masmanidis et al at the California Institute of Technology developed an adhesion process using the Dynatex International Wafer Grip process.

DXB Wafer Bonder

The DXB Wafer Bonder creates void free bonds for use when bonding wafers or glass to temporary substrates for subsequent wafer processing.


·        Wafer Lapping

·        Wafer Polishing

·        Wafer Dicing

·        Any other temporary wafer bonding process

Temporary Wafer Bonding
Applications of temporary wafer bonding include wafer dicing, in which the wafer is cut into individual chips, wafer thinning, in which wafer thickness is reduced for added performance, and wafer polishing or lapping, in order to remove grinding marks and other weak points.

Permanent Wafer Bonding

In semiconductor devices, the applications for permanently bonded wafers are diverse. They range from pressure sensors formed with a sealed cavity in which external pressure is sensed by measuring changes in resistance within the chamber wall. In practice, Micro Electro Mechanical Systems (MEMS) devices are micro-scale machines with extremely small moving parts. These components could be damaged in the conventional wet dicing process. To account for this, a solid glass cover is bonded across the wafer, which then allows the wafer to be diced in the conventional manner without risk to the MEMS device. Furthermore, with the emerging use of indium phosphide and gallium arsenide materials in semiconductor manufacturing, such delicate materials can be bonded to silicon by the room temperature Ultra High Vacuum (UHV) process.

Wafer Bonding Summary

At this point in modern semiconductor manufacturing, wafer bonding is an integral part of the manufacturing process. Temporary bonding using WaferGrip for: dicing, thinning, polishing, lapping and topside wafer processes is embedded into many backside semiconductor manufacturing processes. Permanent wafer bonding is used to: combine materials, create 3D structures and to encapsulate the final device.







The DXB-880 Automatic Void Free Wafer Bonder provides “set and forget” capability.  The automation introduced in the DXB-880 ensures repeatability and a wide process window.  The user is able to program each process node individually and with extreme precision.  To program the system, the process engineer will determine the bonding temperature, bonding pressure, and the duration of each step in the sequence.

The display shows the status of the bonding sequence as it progresses. The program is stored in local memory for easy access and simple operation, and can be password protected to prevent accidental changes.

The DXB-880 wafer bonder also features active cooling and dual chamber technology to provide the ultimate in wafer bonding process control. The dual chamber technology provides the user with the ability to precisely set the bonding pressure, while the active cooling reduces cycle time and can be used to set thermo setting materials.

Elmas Uç ile Çizme ve Kırma (Diamond Scribing-Cleaving and Breaking)


Dry Process Dicing is the best solution for die singulation of high value and high volume devices such as laser diodes, MMIC’s, silicon photonics chips, MEMS, and Biomedical chips. Our precision diamond scribe system utilizes only 3-5 microns of the wafer street, allowing more die per wafer. Further, the patented and unique breaking methods provide precise means of die separation with minimal debris generation and mechanical stress on the die. Dry process dicing helps ensure better quality die, higher overall device yield, and lowers the costs of die singulation.

The DTX Scriber Breaker platform is a stand-alone system with high resolution, linear X, Y, and Theta drives, and digital and analog servo systems to control the axes of motion. The unit is stabilized by a granite base, and designed for ease of operation and maintenance. Facility provided air and vacuum are used for operations of the tool. The platform can be configured as an integrated Scriber Breaker (diamond scribing) or a Breaker only tool.


– Si-Photonics III-V chips

– Laser Diode Cleaving and Matrix Bar-to-Die separation

– OptoElectronics Devices (PhotoDiodes, Modulators, etc.)

– MEMS and BioMedical devices with sensitive structures/coatings

– LED separation (typically  Break Only application)


Integrated Scribe and Break Stages

Multiple Break Types/Assemblies Available

Up to 150 mm Wafer, and “Small” Piece Processing

Full Automatic Processing; or Operator “Driven” Processing